THE FABRICATION
MACHINE THAT
CHANGES EVERYTHING.

Desktop-scale multi-modal fabrication. Direct-fire laser arrays, multi-emitter direct deposition, and combined-beam precision sources — all in one process chamber. Sub-1nm. Chips, batteries, solar film in one continuous vacuum run. No photomask. No silicon.

Pre-loaded chemistry substrate. Individually addressable zones. No photoresist. No wet chemistry. Consumable at 80–92% gross margin per fabrication run.

MoS₂ FeFET non-volatile memory grown into the same monolayer as compute transistors. No separate DRAM. No NAND. No memory bus. No bandwidth bottleneck. Petabyte to exabyte density per die. 2 nanosecond switching — 100,000x faster than NAND. Fabricated in the same WATS chamber run as the chip. The memory wall is eliminated by definition.

DB-1, GB-1, DS-1 variants. Zinc carrier — non-flammable, earth abundant, 2 electrons per ion. No lithium. No thermal runaway. Fabricated by EdgeWATS.

QC-1 solid-state super dielectric. No liquid electrolyte. No flammability risk at any charge state. Capacitor-class charge speed. Zero degradation cycle.

Free-standing multi-junction photovoltaic film without pre-manufactured substrate. Wavelength-addressed photochemical epitaxial growth. No silicon PV process. Efficiency approaching 93% — conventional silicon solar peaks at 26%.

5G NR + WiFi 7 + BT 5.4 + GPS grown into MoS₂. Post-quantum encryption at baseband before RF transmission. No cleartext in the signal chain. No Qualcomm license required.

250 million cores. 2–20 PB on-die memory. Zero thermal output. Zero silicon. One board. Hardware-level anti-cheat. Post-quantum cryptography at chip architecture level. PS5 has 8 cores and 16GB RAM.

Eight-pillar cryptographic suite in silicon. ML-KEM-1024, ML-DSA-87, SLH-DSA, AES-256-GCM, SHA-3-512, BLAKE3. NIST FIPS certified. Hardware-isolated E1-C enclave.

100-layer monolithic MoS₂ stack. 1 million cores. 25 THz clock. Zero thermal dissipation — no cooling required. On-die EdgeMemory. Fabricated in a single WATS chamber run. No silicon. No discrete GPU. No memory bus. Every other chip on Earth is obsolete the day this ships.

10,000-layer monolithic MoS₂ stack. 25 trillion transistors. 100 million cores. 20 exabytes on-die memory. 200 quadrillion FLOPS. Zero cooling. Stack height 6.5 microns — thinner than a human hair. Single WATS recipe file. Not for public discussion — 10-figure conversation only.

EdgeChip E1-C rated for space environments. Radiation-hardened MoS₂ substrate. No silicon, no thermal runaway, no atmospheric cooling dependency. Designed for satellite, orbital platform, and deep-space mission profiles. 25 THz in LEO or beyond.

GPU grown as a recipe-defined zone partition on the same MoS₂ die as the CPU. No discrete GPU card. No HBM. No PCIe bus. Ballistic electron transport — zero heat at full load. 888 million times more compute than an NVIDIA B200. When Zeus or Exodus is your platform, a separate GPU is irrelevant.

Software-defined chip design from descriptor to fabrication-ready recipe in one pipeline. EdgeEDA compiles a .echip design file through Module T7 Security Verification, Module T3 Power Verification, and the RecipeCompiler — producing a locked, SHA-256 hashed .wats recipe file executed directly by the WATS Machine. No Cadence. No Synopsys. No legacy EDA stack required.